The IMAPS Nordic Conference 2008
Hotel Marienlyst, Helsingoer, Denmark
September 14 - 16

IMAPS Nordic is proud to announce its 2008 conference in Denmark. As many times before we will be back at the wonderful Hotel Marienlyst at the beach of Northern Zealand, 5 minutes from Helsingoer. Trains arrive to Helsingoer directly from the airport of Copenhagen.

Exhibitor invitation. (Please click)

For more details, please click the Plan and the first tentative draft of Table locations.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2008. The abstract must be non-commercial and submitted in electronic form on-line at http://www.imapseurope.org/Nordic/Call.asp or emailed to conference.nordic@imapseurope.org no later than April 29. Speakers will be notified of paper acceptance by email by May 31. The deadline for the final paper is July 10.

Proposed topics include:

• Advanced interconnect, Advanced packaging
• Nano technology, nano scale packaging, nano materials
• Chip stacking, 3D-packaging, embedding, TSV (Through silicon vias)
• Integrated passive device (IPD) & System in Package (SiP)
• Ceramics: thickfilm, thin film, DBC, LTCC
• HDI laminates, flex, embedded passives & actives
• Unique materials, PTF, underfills, ACF, encapsulation
• Future electronics, trends & strategies
• CSP, flip chips, bumping, wafer thinning
• Manufacturing technology, system cost & outsourcing
• MID, MEMS, sensors v SMT and board assembly
  

Tutorial suggestions for Sunday 14.9. 2008 are also welcome to conference.nordic@imapseurope.org.

To submit an abstract on-line, visit http://www.imapseurope.org/Nordic/Call.asp.